A report by The Information’s Wayne Ma and Qianer Liu sheds light on Apple’s ambitious plans for the iPhone 17 Air, which is expected to be the thinnest iPhone ever, measuring just 5mm to 6mm thick. This dramatic reduction in size, compared to the iPhone 16 lineup, introduces several design compromises as Apple pushes the boundaries of smartphone engineering.
The device is rumored to lack a physical SIM card tray, potentially relying exclusively on eSIM technology, a move that aligns with Apple’s recent U.S. models but marks a shift for international markets. Space constraints have also led to the inclusion of only a single speaker in the earpiece, as there is no room for a second speaker on the bottom edge.
The iPhone 17 Air is expected to feature a single, centered rear camera housed in a prominent aluminum bump, departing from the multi-camera systems of its predecessors. It will also debut Apple’s first in-house 5G modem, which is reportedly smaller and more efficient but lacks mmWave 5G support, resulting in slower data speeds compared to Qualcomm modems.
Challenges remain as Apple works through early production trials at Foxconn, particularly in fitting essential components like the battery into the ultra-thin frame. However, the device is set to include advanced features such as a 6.6-inch display, A19 chip, Dynamic Island, Face ID, and 8GB of RAM, promising a powerful user experience despite its minimalist build.
