Apple is planning a major redesign of its iPhone memory architecture to enhance AI performance in future models. According to South Korea’s The Elec, this change will separate the DRAM from the System-on-Chip (SoC), marking a departure from the package-on-package (PoP) design used since 2010. The transition is expected to begin with the 2026 iPhone lineup.
PoP memory design, while compact and space-efficient, limits the number of input/output pins, constraining memory bandwidth and data transfer speeds needed for advanced AI applications. Moving to discrete memory packaging will physically separate the memory from the SoC, allowing for higher performance by increasing I/O pins, boosting data transfer rates, and improving heat dissipation.
Samsung, a key Apple supplier, is reportedly developing next-generation LPDDR6 memory to meet Apple’s requirements. This includes LPDDR6-PIM (Processor-in-Memory) technology, which integrates computational capabilities directly into the memory for faster and more efficient data handling.
While Apple has used discrete memory designs in its Mac and iPad lines, adapting this approach for the iPhone’s compact form factor presents challenges. Changes to internal layouts, such as resizing the SoC or battery, may be needed to accommodate the new architecture. Though discrete packaging may slightly increase power consumption and latency, the anticipated performance gains for AI justify the shift.
Apple’s move reflects its broader commitment to innovation and maintaining a competitive edge in AI-enabled smartphones. If successful, this redesign could position the company as a leader in next-generation mobile technology.
